Electrodeposition Module

ELECTROPLATING: Thickness of the decorative deposited layer in a furniture fitting modeled using simulations based on secondary current distribution
ELECTROPLATING: Thickness of the decorative deposited layer in a furniture fitting modeled using simulations based on secondary current distribution
Modeling and simulations are cost effective ways for understanding, optimizing, and controlling electrodeposition processes. A typical simulation yields the current distribution at the surface of the electrodes and the thickness and composition of the deposited layer. They are used to study important parameters such as: cell geometry, electrolyte composition, electrode kinetics, operating voltages and currents, as well as temperature effects.

The Electrodeposition Module brings the power of COMSOL Multiphysics to simulate electrodeposition processes. Easy-to-use physics interfaces are provided for primary, secondary, and tertiary current distribution models, while very accurate geometric representations of deposited layer buildup are included as model parameters. The shape of the electrode can also be simulated with moving boundaries

The Electrodeposition Module is applicable to a variety of diverse applications including; metal deposition for electronics and electrical parts, corrosion and wear protection, decorative electroplating, electroforming of parts with thin and complex structure and metal electrowinning.
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